TIM (Organic Silicon Thermal Interface Material)
KCC thermal management materials can provide optimized thermal conductivity on permanently higher operating temperature systems. The KCC thermal management series also provides an effective dual function-dissipate the heat of the device to the radiator and form a strong and flexible mechanical bond.
Scope of application
1. Fill the gap between the heat sink and the PCB substrate
2. DC motor, PTC heater, regulator, ECU parts are fixed
Adhesive materials
3. Gap Filler is used for ECU, LED lighting
4. Potted capacitors and inductors
Features
1. Excellent heat resistance (low BLT)
2. Low oil loss
3. Low hardness and pressure
4. Low volatile content
5. High thermal conductivity
6. Excellent heat resistance
7. Various viscosity and good processability
8. Suitable for various working methods
Thermally Conductive Flame Retardant Adhesive
Compressed/extruded thermally conductive silicone that can be used in some electronic products, electrical appliances and computers. When they work, they become hotter.
Scope of application
Thermal conductive sheet, cap, tube
Features
1. Excellent thermal conductivity
2. Excellent flame retardancy, UL 94V-0
3. The roller has good processability
Product application characteristics table
Thermally conductive material Qantek
Able to meet future needs
Suitable for various industrial fields and multiple purposes.
By combining organic and inorganic materials, Improve the chemical and physical properties of materials.